Please refer to product section for more information. Note: Not all of C&K products have been tested to this profile. Thermal profile done 2 times on each part listed The reflow oven is used primarily for the reflow soldering of surface mount electronic components to printed circuit boards (PCB).Maximum time above 183☌ for 60 seconds.Reflow at a maximum of 245☌ for 10 seconds.Pre-heat to a maximum of 200☌ for 30 seconds Recommended wave soldering profile Figure 2.Thermal profile in accordance with CEI 6 / EN 6.Refer to the solder paste data sheet for specific reflow profile recommendations. Do not exceed a 190✬ peak temperature (Tp). Thermal profile done 2 times on each part tested The SAM9X60D1G-I/LZB can be soldered to the host PCB by using the standard Sn-Bi solder reflow profile.Once the flux is activated, the chemical reaction removes the surface oxides from both the component leads and PCB pads to promote soldering once the solder becomes molten. The pre-reflow section is where the flux is activated. SMT Reflow Soldering Profile of Reference The ramp rate should be 0.5 2.0☌/second and depends greatly on the belt speed4. The reflow soldering technique resembles the traditional soldering process in many ways. The solder reflows to make the connection. Do not immerse or spray the unsealed areas of the switches with cleaners during flux removal. Reflow soldering is a process in which solder paste is applied to the contact pads of a PCB, place the components on and melt the solder paste to join the electrical components. Cool Down This is the final stage in the process where gradual cooling should be used. Note the wetting time is shown as the time the solder is in a liquid state around 183☌ on the curve. Solder time is approximately 3 seconds maximum. Reflow In this stage, the assembly is brought to the temperature sufficient to produce reflow of the solder. Hand soldering and cleaning are acceptable with properly trained personnel, small diameter solder (.030-.040 in.) and low wattage soldering irons (25-40 watts max.). Care during soldering and cleaning can prevent most process contamination problems encountered.Ĭontamination can occur in both hand soldering and machine soldering processes. Switches may become intermittent, especially in low power applications, and may become open during factory testing or later in the field. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. Profile Feature SnPb eutectic assembly Pb-free assembly Average ramp-up rate (Tsmax to Tp) 3 ☌/s maximum 3 ☌/s maximum Preheat. The dimensions of the glass epoxy boards with resist are 90 ×50 0. Reflow Soldering Profile Limiting Values The below temperature profile for moisture sensitivity characterization is based on the IPC/JEDEC joint industry standard: J-STD-020C. High peak temperature can cause the damage of the component, damage of the assembly or detach of the pervious soldered components.Most manufacturing and field problems experienced by users of unsealed switches are caused by contamination of the internal switch contacts during soldering and cleaning processes. Time maintained Reflow number above 230 63 to 100V 4 to 63V (Except 63V for MVH) The following conditions are recommended for air convection and infrared reow soldering on the SMD products onto a glass epoxy circuit boards by cream solder. Since larger components normally reach lower maximum temperatures during reflow than smaller ones, because of the different heat capacities, keeping them below their ratings may not be difficult, as long as 250 ☌ is used as the maximum temperature for the joints of smaller components. This means that 250 ☌ may not be usable as the maximum joint temperature for some components a lower temperature may be required. Although Intel BGAs are generally rated at 260 ☌, other components, especially large ones, may be rated at 250 ☌ or 245 ☌. Components are typically rated as per J-STD-020C (or later), based on their package thickness and volume. Higher T g material is not necessarily more resistant to this damage, and must be tested for compatibility. If maximum solder joint temperatures exceed 250 ☌, PCB damage such as delamination and warpage may result when standard FR4 (T g =130 ☌) material is used. 250 ☌ is recommended as the maximum temperature for all solder joints on the board, except for components with temperature ratings lower than 250 ☌.
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